主要技术内容
本标准规定了半导体制冷器具的总体要求、技术要求、试验方法、检验规则以及标志、包装、运输和贮存。
其中，总体要求对工作环境、工作电源、热电材料以及设计、安全要求作出规定，技术要求包括外观结构、
凝露、噪声、耗电量、最大制冷温差、响应时间、可靠性要求以及电磁兼容性要求，并给出了对应的试验方法。
适用于半导体制冷器具的设计、生产与检验。
This standard specifies the general requirements, technical requirements, test methods, inspection rules,
as well as marking, packaging, transportation and storage of semiconductor refrigeration appliances.
Among them, the overall requirements stipulate the working environment, working power supply,
thermoelectric materials, as well as design and safety requirements. The technical requirements include
appearance structure, condensation, noise, power consumption, maximum cooling temperature difference,
response time, reliability requirements and electromagnetic compatibility requirements, and corresponding
test methods are provided. It is applicable to the design, production and inspection of semiconductor
refrigeration appliances.
适用范围
是否包含专利
否
